Amkor Technology, Inc.

Amkor Technology provides outsourced semiconductor packaging and test services globally. Services include turnkey packaging and testing, wafer bumping, and drop shipment. Products include flip chip scale packages, stacked chip scale packages, and memory products. Other products include wafer-level CSP and fan-out packages, leadframe packages, and substrate-based wirebond packages. The company also offers micro-electro-mechanical systems packages and advanced system-in-package modules. Services include wafer, package, and system level testing, as well as burn-in test and development services. Amkor serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries.

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